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Raspberry PI 3 - ECASE
par MVdS
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The objective was to design a PI 3 case with:
- minimal footprint
- very compact
- maximum protection (for dust, ESD, mechanical impact)
- very easy to add or to remove
- space for CPU RAM and GPU heatsink
- allowing cooling by natural ventilation
- connectors easily accessible
- GPIO easily accessible for lead connectors or small footprint 40PIN IDC.
- easy to print
- minimal footprint
- very compact
- maximum protection (for dust, ESD, mechanical impact)
- very easy to add or to remove
- space for CPU RAM and GPU heatsink
- allowing cooling by natural ventilation
- connectors easily accessible
- GPIO easily accessible for lead connectors or small footprint 40PIN IDC.
- easy to print
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