TP Link EAP773 Elevated Cooling Platform

TP-Link Omada WiFi 7 Wireless Access Point EAP773 Elevated Cooling Platform for TP-Link Omada Access Points This custom-designed tabletop platform is engineered to solve the heat dispersal issues common with high-performance TP-Link Omada endpoints (such as the EAP773). Ideally these should be wall mounted, but sometimtes you can't for a variety of reasons. By lifting the unit off your desk or furniture, it provides passive cooling while protecting your surfaces. Key Design Features: Passive Thermal Management: Elevates the Omada access point exactly 45mm off the tabletop. This creates a critical air gap that allows ambient airflow to dissipate heat from the bottom of the device before it can build up. Surface Protection: By utilizing the natural thermal insulating properties of 3D printed filament alongside the 45mm standoff, this stand completely protects delicate wood surfaces and finishes from the constant heat output of enterprise-grade networking gear. Integrated Cable Routing Ch